Lester A. D'Cruz

Applied Materials, Inc
State-of the art IC chip manufacturing equipment for Plasma-enhanced Chemical Vapor Deposition of dielectric thin films.  (List of patents;  List of conference papers)

(2008-2009) Global Product Marketing Manager – CMP Division
  • Delivered a 60% performance improvement in 6 months achieved with component re-design and cost-reductions in Chemical Mechanical Polishing (CMP) consumables; Effort helped position oxide polish products for continued market leadership at cutting-edge factories worldwide.

(2005-2008) Customer Technical Programs Manager – Dielectric Division
  • Contributed to a  $12 million (10%) year-over-year gain in dielectric systems revenue in the Japan region for FY2006 by addressing top customer concerns with timely process and hardware solutions; Achieved turnaround by combining systematic analysis of past business loss in the Japan region with monthly trips to regional offices and customers
  • Enhanced customer satisfaction by championing strategic component upgrades for multiple on-site evaluations, which led to multiple revenue shipments to prominent Japan customers
  • Led a rapid new product qualification effort, which displaced competition at major Japan IC manufacturer and contributed $60 million in new dielectric products revenue for 2007

(2003-2005) Senior Member of the Technical Staff - Equipment Development Lead
  • Coordinated all product release tasks to enable timely shipment of 3rd generation Low-k doped dielectric tool, including lead role in a start-up product development team; Established baseline processes within 6 months, successfully executed live demonstrations, and secured Joint Development Programs with major customers in Europe and Asia

(2000-2003) Engineering Manager, Key Account Technology
  • Maintained 100% market share at prominent logic IC manufacturers during industry technology transition from 200mm to 300mm wafer size by successfully positioning six critical PECVD dielectric processes during customer equipment re-qualifications
  • Penetrated prominent US logic manufacturers with a bridge technology for dielectrics in copper interconnect schemes (low stress, fluorine-doped oxide film), which secured revenue for three generations of dielectric technology
  • Improved field-support response time and customer satisfaction by driving documentation updates for product and processes; Authored manuals with detailed process recipes, equipment start-up protocols, and troubleshooting strategies


(1997-2000) Senior Process Engineer, Dielectric Deposition Systems and Modules
  • Played a pivotal role in the debugging and continuous improvement of Applied Materials’ ProducerTM CVD product; Actively supported the product’s success in US and Europe as a worldwide standard
  • Executed exploratory projects that resolved an incessant dielectric film peeling issue during early copper interconnect development at European device manufacturer; Documented process and hardware learning to allow global implementation in the installed-base

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