Lester A. D'Cruz

Publications (during tenure at Applied Materials, Inc)

Refereed Conference Presentations (Plasma-Enhanced Chemical Vapor Deposition Technology)
  1. Lester D’Cruz, Sang Ahn, Yi Zheng, Josephine Chang, Nagarajan Rajagopalan, Thomas Nowak, Alex Demos, Girish Dixit, Derek Witty and Hichem M’saad, “Film Properties and Integration Performance of a Nano-Porous Carbon Doped Oxide”, MRS Spring meeting, San Francisco, CA Mar 28 – April 1, 2005.
  2. G. Dixit, L. D’Cruz, Sang Ahn, Josephine Chang, Mehul Naik, Alex Demos, Derek Witty and Hichem M’Saad, “Film Properties and Integration Performance of a Nano-porous Carbon-Doped Oxide”, IITC International Interconnect Technology Conference, San Francisco, CA  June 7-9, 2004.
  3. A. Demos, L. D’Cruz, F. Schmitt, Y. Zheng, H. Armer, and H. M’Saad, “A Thermally Stable,  k< 2.5 Carbon –Doped Oxide Film Deposited by a Plasma-Enhanced CVD Process”,  205th Meeting of The Electrochemical Society, San Antonio, TX  May 9-14, 2004
  4. L. D’Cruz and C. Bencher, “PECVD F-TEOS Dielectric Technology for Damascene Copper Interconnects”, Proceedings 7th International DCMIC (Dielectric and Conductors for ULSI Multilevel Interconnection Conference), 2001, pp160-164.
  5. L. D’Cruz , C. Bencher and C. Ngai,  “PECVD SiN Performance as Barrier/Etch Stop for Damascene Copper Interconnects”,  Proceedings 7th International DCMIC (Dielectric and Conductors for ULSI Multilevel Interconnection Conference), 2001, pp151-155.

List of publications and presentations at the Applied Materials– Engineering and Technology Conferences (Internal)
  1. Mehul Naik et al, “Feasibility Studies on the Integration of Porous Low-k Materials for Sub 65nm Node Technology”, Engineering and Technology (ET) Conference of Applied Materials, Santa Clara 2003.
  2. Bipin Thakur et al, “Post Via Etch Defect Resolution for FSG Cu Damascene at IBM”, Engineering and Technology (ET) Conference of Applied Materials, Santa Clara 2003.
  3. “200mm Producer Black DiamondTM Defect Reduction as a Result of Recipe Optimization”, Engineering and Technology (ET) Conference of Applied Materials, Santa Clara 2003.
  4. Lester D’Cruz et al, “Using Single Variable PECVD Process Trends to Establish Chamber Matching Limits on ProducerTM Twin Chambers”, Engineering and Technology (ET) Conference of Applied Materials, Santa Clara 2002.
  5. Lester D’Cruz and Tom Nowak, “ NH3 Treatment/ Nitride Barrier Deposition for Copper Damascene Applications”, Engineering and Technology (ET) Conference of Applied Materials, Santa Clara 2001.
  6. Jeff Lin, Miguel Fung, Betty Tang and Lester D’Cruz, “Capacitance-Voltage Behavior of PECVD Nitride Films for Advanced Metal-Insulator-Metal (MIM) Capacitors”, Engineering and Technology (ET) Conference of Applied Materials, Santa Clara 2001.
  7. Betty Tang and Lester D’Cruz, “Using Mixed Frequency Silicon Nitride Film for Advanced Pre-Metal Dielectric Applications”, Engineering and Technology (ET) Conference of Applied Materials, Santa Clara 2001.
  8. Bipin Thakur, Chris Bencher and Lester D’Cruz, “Low Hydrogen Nitride for FSG Integration in Copper Dual Damascene”. Engineering and Technology (ET) Conference of Applied Materials, Whistler, Canada 2000.
  9. Lester D’Cruz, et al. “Electrical Performance of MOS Transistors with PECVD Nitride as Local Interconnect Etch Stop Layer”, Engineering and Technology (ET) Conference of Applied Materials, San Jose, 1999.

(see all Applied Materials experience)